Production Process

Inner Layer Production

Contemporary methods of inner layer production haven’t changed significantly in over forty years. Plotters have become faster and more accurate. The global uptake of LDI has been modest – the market doesn’t need an expensive exposure unit for the majority of PCBs. Whatever the imaging technique, the basic process has remained the same… use lots of interdependent equipment and chemistry to completely cover a panel with photo resist. Then use some more interdependent equipment and chemistry to remove most of it! This is a timely, wasteful and costly process.

Contemporary inner layer production flow – conventional lithography

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  • Costly and complex
  • Registration constraints
  • Yield constraints
  • Environmental constraint – process waste handling
  • Infrastructure constraint – clean room etc.
  • From data to print in days

Contemporary inner layer production flow – LDI

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  • More costly than conventional lithography
  • Complexity remains
  • Registration constraints eliminated
  • Eliminates film work
  • Can be detrimental to yield (dependant on other processes)
  • Environmental constraints – process waste handling
  • Increased infrastructure constraints – clean room etc.
  • From data to print in hours

Inner layer production flow Lunaris

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  • Significant cost savings compared to conventional lithography and LDI
  • Dramatically reduced complexity – single step digital imaging
  • From data to print in minutes – no set up time
  • Guaranteed 100% yield into etch line
  • Eliminates registration constraints
  • Eliminates film work
  • Eliminates environmental constraints
  • Eliminates infrastructure constraints – clean machine design